COB
High hardness, low shrinkage, great dimensional stability, and adhesive performance while applying in different materials. Excellent in thermal shock, mechanical properties, humidity, and heat. These products are able to apply in printing and dispensing process.
| Characteristics | Cure | Application | |
|---|---|---|---|
| C-08B | Matte | 130°C*90min | General liquid encapsulation |
| C-06G | Glossy | 130°C*90min | General liquid encapsulation |
| P-09B | Low CTE、Low stress、Low moisture absorption | 100°C*60min 150°C*60min |
Specific liquid encapsulation |
| DU-02F | Cure at low temp. | 100°C*30min | Low temperature die bond paste |
| A-06D | Cure at high temp | 130°C*30min | High temperature die bond paste |
| P-08B | Low CTE、Low stress | 130°C*90min | General liquid encapsulation, suitable for printing. |
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