Underfill
Cure quickly at low temperature, great stability at room temperature, low viscosity, excellent permeability, and electrical insulation. Fast curing, low stress, and low moisture absorption. proper heating can accelerate fluidity.
| Characteristics | Cure | Application | |
|---|---|---|---|
| U-02F | 100°C*30min | Excellent coating on solder ball, reworkable. | |
| U-12F | 125°C*120min165°C*120min | Excellent coating on solder ball | |
| U-21F-1 | Excellent fluidity Fast cure at low temp. | 80°C*30min | Excellent coating on solder ball, reworkable. |
| U-25F | Low CTELow moisture absorption | 125°C*120min165°C*120min | Excellent coating on solder ball, and excellent adhesion to the base material. |
| U-26F | Low CTELow moisture absorption | 125°C*120min165°C*120min | Excellent coating on solder ball, and excellent adhesion to the base material. |
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