Adhesive

Application: It is suitable for materials with different expansion coefficients, good adhesion with same and different materials. It is also suitable for dispensing and printing processes.

Excellent adhesion at high temperature and low stress, suitable for materials with different expansion coefficients. Excellent chemical resistance, and suitable for dispensing needles below 27 gauge. It can pass the Reflow test and has good adhesiveness and east to storage. good adhesion with same and different materials. It is suitable for dispensing and printing processes.

Characteristics Cure Application
A-08D series Reflow resistant 130°C*30min High temp. baking
A-11D series Cure at low temp
Easy to store
Excellent stability
80°C*30min Low temp. baking, suitable for LCP.
A-13D series Cure at low temp
Easy to store
Excellent stability
70°C*60min Low temp. baking
A-15D series Cure at low temp
Easy to store
Excellent stability
90°C*30min Low temp. baking, suitable for PA.
KA-08H series Reflow resistant 130°C*30min High temp. baking, High thixotropy.

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